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2021-11-04 - Colloque/Présentation - communication orale - Anglais - 18 page(s)

Jolly Anju , Cobley Andrew, Vitry Véronique , Wu Liang, "FUNCTIONAL NICKEL COATINGS AIMED AT SURFACE DEFECT MITIGATION IN ADDITIVELY MANUFACTURED PARTS OBTAINED BY ELECTRODEPOSITION" in 4 TH INTERNATIONAL CONFERENCE ON EMERGING TECHNOLOGIES IN MATERIALS ENGINEERING, Bucharest, Roumanie, 2021

  • Codes CREF : Chimie des surfaces et des interfaces (DI1327), Mécanique appliquée générale (DI2100)
  • Unités de recherche UMONS : Métallurgie (F601)
  • Instituts UMONS : Institut de Recherche en Science et Ingénierie des Matériaux (Matériaux)
  • Centres UMONS : Ingénierie des matériaux (CRIM)

Abstract(s) :

(Anglais) The versatility of Stainless steel Additively Manufactured (AM) parts, in fields ranging from medicine to aerospace engineering [1, 2], is severely challenged by defects in the early manufacturing stages [3]. Lack of fusion and gas entrapment leads to increased surface roughness and undesired porosities [4]. In this study, a methodology has been developed to simulate AM type defects on stainless steel substrates. Influenced by the filling-focussed coating studies in the electronics industry [5], on vias that resemble AM type defects, plating parameters such as current density, concentration, temperature, mechanical agitation, additives, etc., can impact the deposit properties and subsequent filling effect. Therefore, an investigation into the possibility of using Ni electrodeposition to level and fill the surface voids and defects on stainless-steel AM parts is attempted with the use of stainless-steel substrates with simulated defects, thereby improving properties like fatigue resistance, anticorrosive nature, ductility, etc.

(Anglais) The versatility of Stainless steel Additively Manufactured (AM) parts, in fields ranging from medicine to aerospace engineering [1, 2], is severely challenged by defects in the early manufacturing stages [3]. Lack of fusion and gas entrapment leads to increased surface roughness and undesired porosities [4]. In this study, a methodology has been developed to simulate AM type defects on stainless steel substrates. Influenced by the filling-focussed coating studies in the electronics industry [5], on vias that resemble AM type defects, plating parameters such as current density, concentration, temperature, mechanical agitation, additives, etc., can impact the deposit properties and subsequent filling effect. Therefore, an investigation into the possibility of using Ni electrodeposition to level and fill the surface voids and defects on stainless-steel AM parts is attempted with the use of stainless-steel substrates with simulated defects, thereby improving properties like fatigue resistance, anticorrosive nature, ductility, etc.